COURSE / module Detail
Simulation Techniques to Evaluate ELK Stress during Chip Attach Process and Mitigate Failure
Description: This workshop is a hands-on tutorial on completing a simulation for this failure mode. The tutorial includes example files, analysis settings and best-known methods. The workshop will rely on the use of Ansys Sherlock, Ansys Mechanical and Ansys SpaceClaim inside the Ansys Workbench environment. Target audience: Flip chip component designers and integrators, assembly bumping designers and manufacturers, chip attach, packaging and assembly engineers
Unit: 118 min
Cost: $105.00
Rating: 
