COURSE / module Detail
A Methodology for Understanding the Reliability of Electronic Packaging
Description: The course will then discuss the relatively new failure mechanism, that of silicon wearout. As gate geometries have continued to shrink, the susceptibility of the device to fail has increased, to a point where some of the newer 14 nm feature devices will not hold up well in high reliability applications. We will look at the intrinsic mechanisms of ICs to understand their susceptibility based on environments.