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Thermally Induced Failures and Reliability Risks created by Advancements in Electronics Technologies

Description: Being able to model the assembly with respect to Reliability Physics is an effective way to identify the issues in a design even prior to creating a prototype. This talk will delineate some of the issues involved in device and PWB packaging as well as how a modeling approach can facilitate their identification so they can be corrected.

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Cost: $70.00

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